Clock Feedthrough Compensation in Image Sensor Systems

ABSTRACT

A pixel circuit and method for operating the same is disclosed. The circuit includes a first driver circuit coupled to receive an analog pixel data, transfer signal and reset signal. The circuit further includes a source follower transistor having a source terminal coupled to a column node, and a gate terminal coupled to the first driver circuit. The circuit further includes a second driver circuit coupled to receive the transfer signal and the reset signal. The second driver circuit is capacitively coupled to the column node through a first capacitor.

PRIORITY CLAIM

This application claims priority to U.S. Provisional Application62/680,010, entitled “Clock Feedthrough Compensation in Image SensorSystems”, filed Jun. 4, 2018, the disclosure of which is incorporatedherein in its entirety.

BACKGROUND Technical Field

This disclosure is directed to electronic systems, and moreparticularly, to image sensor systems.

Description of the Related Art

High quality image sensor systems have often utilized a single slopeanalog to digital converter (ADC) architecture due to its gooduniformity, power efficiency and compactness. More recently, SuccessiveApproximation Register (SAR) ADC architectures have been adopted forimage sensor systems due to their speed benefit. The speed of a SAR ADCoriginates from the binary operation of a digital to analog converter(DAC) within the SAR ADC. On the other hand, in order to improve overallimage system speed, the pixel settling is also important.

SUMMARY

A pixel circuit and method for operating the same is disclosed. In oneembodiment, a circuit includes a first driver circuit coupled to receivea transfer signal and reset signal. The circuit further includes asource follower transistor having a source terminal coupled to a columnnode, and a gate terminal coupled to the first driver circuit. Thecircuit further includes a second driver circuit coupled to receive thetransfer signal and the reset signal. The second driver circuit iscapacitively coupled to the column node through a first capacitor.

In one embodiment, the first driver circuit conveys pixel data to thegate terminal of the source follower transistor responsive to assertionof the transfer signal. The source follower amplifies the voltage of thepixel data on the column node. The second driver circuit conveys theamplified or buffered reset or transfer signal to a terminal of thefirst capacitor responsive to assertion of the reset or transfer signal.Responsive to receiving the amplified or buffered reset or transfersignal on the first terminal, the capacitor conveys, through a secondterminal, a controlled disturbance voltage onto the column node.Effectively, the capacitor provides feedforward path introducing zero tothe single pole system.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description makes reference to the accompanyingdrawings, which are now briefly described.

FIG. 1 is a diagram illustrating one embodiment of an image sensingsystem.

FIG. 2 is a diagram illustrating one embodiment of a group ofmultiplexed pixel units of an image sensing system.

FIG. 3 is a diagram of one embodiment of a capacitive digital-to-analogconverter (CDAC).

FIG. 4 is a diagram illustrating one embodiment of an apparatus coupledto convey a dithering signal to the input of an amplifier concurrentwith another input signal.

FIG. 5 is a flow diagram illustrating one embodiment of a methodperforming an analog-to-digital conversion in a SAR ADC having a CDAC.

FIG. 6 is a flow diagram illustrating one embodiment of a method forselecting pixel circuits in the processing of pixel data.

FIG. 7 is a flow diagram illustrating one embodiment of a method forperforming a comparison in which a dithering signal is applied alongwith an input signal to one input of the comparator.

FIG. 8 is an illustration of one embodiment of a pixel circuit andcompensation driver.

FIG. 9 is a flow diagram illustrating one embodiment of a method foroperating a pixel circuit.

FIG. 10 is a diagram illustrating one embodiment of an apparatus forcontrolling the slope of a power enable signal and a diagramillustrating operation of the same.

FIG. 11 is a diagram illustrating one embodiment of anintegrate-and-reset pre-amplifier used in an embodiment of a comparator.

FIG. 12 is a table illustrating repeat sampling patterns usable in oneembodiment of an image sensing system.

FIG. 13 is a flow diagram of one embodiment of a method for powering upand powering down a comparator using a slope-controlled power enablesignal.

FIG. 14 is a flow diagram illustrating one embodiment of a method forselectively repeating a sampling process for particular ones of a numberof pixel circuits.

FIG. 15 is a block diagram of one embodiment of an example system.

Although the embodiments disclosed herein are susceptible to variousmodifications and alternative forms, specific embodiments are shown byway of example in the drawings and are described herein in detail. Itshould be understood, however, that drawings and detailed descriptionthereto are not intended to limit the scope of the claims to theparticular forms disclosed. On the contrary, this application isintended to cover all modifications, equivalents and alternativesfalling within the spirit and scope of the disclosure of the presentapplication as defined by the appended claims.

This disclosure includes references to “one embodiment,” “a particularembodiment,” “some embodiments,” “various embodiments,” or “anembodiment.” The appearances of the phrases “in one embodiment,” “in aparticular embodiment,” “in some embodiments,” “in various embodiments,”or “in an embodiment” do not necessarily refer to the same embodiment.Particular features, structures, or characteristics may be combined inany suitable manner consistent with this disclosure.

Within this disclosure, different entities (which may variously bereferred to as “units,” “circuits,” other components, etc.) may bedescribed or claimed as “configured” to perform one or more tasks oroperations. This formulation—[entity] configured to [perform one or moretasks]—is used herein to refer to structure (e.g., something physical,such as an electronic circuit). More specifically, this formulation isused to indicate that this structure is arranged to perform the one ormore tasks during operation. A structure can be said to be “configuredto” perform some task even if the structure is not currently beingoperated. A “credit distribution circuit configured to distributecredits to a plurality of processor cores” is intended to cover, forexample, an integrated circuit that has circuitry, that performs thisfunction during operation, even if the integrated circuit in question isnot currently being used (e.g., a power supply is not connected to it).Thus, an entity described or recited as “configured to” perform sometask refers to something physical, such as a device, circuit, memorystoring program instructions executable to implement the task, etc. Thisphrase is not used herein to refer to something intangible.

The term “configured to” is not intended to mean “configurable to.” Anunprogrammed FPGA, for example, would not be considered to be“configured to” perform some specific function, although it may be“configurable to” perform that function after programming.

Reciting in the appended claims that a structure is “configured to”perform one or more tasks is expressly intended not to invoke 35 U.S.C.§ 112(f) for that claim element. Accordingly, none of the claims in thisapplication as filed are intended to be interpreted as havingmeans-plus-function elements. Should Applicant wish to invoke Section112(f) during prosecution, it will recite claim elements using the“means for” [performing a function] construct.

As used herein, the term “based on” is used to describe one or morefactors that affect a determination. This term does not foreclose thepossibility that additional factors may affect the determination. Thatis, a determination may be solely based on specified factors or based onthe specified factors as well as other, unspecified factors. Considerthe phrase “determine A based on B.” This phrase specifies that B is afactor that is used to determine A or that affects the determination ofA. This phrase does not foreclose that the determination of A may alsobe based on some other factor, such as C. This phrase is also intendedto cover an embodiment in which A is determined based solely on B. Asused herein, the phrase “based on” is synonymous with the phrase “basedat least in part on.”

As used herein, the phrase “in response to” describes one or morefactors that trigger an effect. This phrase does not foreclose thepossibility that additional factors may affect or otherwise trigger theeffect. That is, an effect may be solely in response to those factors,or may be in response to the specified factors as well as other,unspecified factors. Consider the phrase “perform A in response to B.”This phrase specifies that B is a factor that triggers the performanceof A. This phrase does not foreclose that performing A may also be inresponse to some other factor, such as C. This phrase is also intendedto cover an embodiment in which A is performed solely in response to B.

As used herein, the terms “first,” “second,” etc. are used as labels fornouns that they precede, and do not imply any type of ordering (e.g.,spatial, temporal, logical, etc.), unless stated otherwise. For example,in a register file having eight registers, the terms “first register”and “second register” can be used to refer to any two of the eightregisters, and not, for example, just logical registers 0 and 1.

When used in the claims, the term “or” is used as an inclusive or andnot as an exclusive or. For example, the phrase “at least one of x, y,or z” means any one of x, y, and z, as well as any combination thereof.

In the following description, numerous specific details are set forth toprovide a thorough understanding of the disclosed embodiments. Onehaving ordinary skill in the art, however, should recognize that aspectsof disclosed embodiments might be practiced without these specificdetails. In some instances, well-known circuits, structures, signals,computer program instruction, and techniques have not been shown indetail to avoid obscuring the disclosed embodiments.

DETAILED DESCRIPTION OF EMBODIMENTS

The present disclosure is directed to various embodiments of an imagesensor system. Various optimizations disclosed herein may allow an imagesensor system to operate at greater speeds with less power consumptionwhile reducing/minimizing the various sources of noise that canotherwise degrade image quality.

In various embodiments, an image sensor system accordingly to thisdisclosure includes pixel units each having a number of pixel circuits.The pixel circuits are coupled to provide pixel data to a comparator ofa SAR ADC, via a multiplexer. In one embodiment, the pixel data isprovided to the comparator as a continuous analog signal, as nosample-and-hold circuit is provided on that comparator input, which mayreduce the impact of aliased thermal noise on the image quality. Theother comparator input may receive, for a basis of comparison, an analogsignal generated by a SAR ADC.

The SAR ADC may include a CDAC having a number of circuit elements usedin generating the analog signal. For a given iteration, not all of thecircuit elements are used. Furthermore, for any given iteration, thecircuit elements of the CDAC may be randomly selected for use ingenerating the analog signal, and the random selection may occur withinsubsets that are independent (and thus orthogonal) from one another.Random selection of the elements may help to average out image noisethat may result from an issue known as integral nonlinearity (INL).

Another nonlinearity issue differential nonlinearity (DNL) may beaddress through the application of a dithering signal to the same inputas the analog signal output from the CDAC. In some embodiments, aseparate DAC may be provided to generate the dithering signal, while inother embodiments, the circuitry for generating the dithering signal maybe merged into the existing CDAC. Application of the dithering signal,which may be performed on a per-frame basis, may randomize systematiclinearity errors in the CDAC and may improve DNL performance.

In some embodiments, the order in which pixel circuits are selected toprovide pixel data for conversion to digital may be randomized. Forexample, if pixel circuits are arranged in columns, the selection ofcolumns may be randomly shuffled from one frame to the next. The randomselection of pixel circuits, through column shuffling or some othermechanism, may help reduce fixed patter noise that can otherwise reduceimage quality.

Embodiments in which the pixel circuits include compensation circuitryare possible and contemplated. For example, a portion of the pixelcircuitry may be replicated to provide a compensation circuit. Or simplebuffer or amplifier circuits may be used. The main portion of the pixelcircuit may be coupled to a source follower configured to amplify pixeldata conveyed onto a column node (the column node being coupled directlyto ADC or to a multiplexer which is in turn coupled to an ADC). Thecompensation circuit portion of the pixel circuit may be capacitivelycoupled to the column node, and may provide a disturbance voltagethereto. The disturbance voltage applied to the column node concurrentwith the pixel data (via the source follower) may reduce the settlingtime of the column line. This may in turn reduce residue patterns thatcan result from clock feedthrough during operation of the pixelcircuits.

Various power saving featured may be implemented in embodiments of theimage sensor system disclosed herein. In one embodiment, the comparatorof the ADC may be powered down up when an ADC input is to be processedand powered down when input is not processed. A power enable signal maybe slope-controlled such that the powering up and powering down of thecomparator is likewise controlled. Powering the comparator up and downin a controlled manner may in turn reduce the occurrence and magnitudeof power supply disturbances (e.g., voltage droops) from sudden changesin current demand (e.g., current surges). In image systems havingmultiple ADCs, the powering up and down of comparators in each may alsobe staggered relative to one another, further minimizing power supplydisturbances. It is noted that many of the embodiments discussed hereinutilize correlated double sampling (CDS), and as such, a givencomparator may be powered up and down twice in performing a quantizationprocess of pixel data provided from a corresponding pixel circuit.

With respect to the comparator of an ADC, various embodiments mayinclude therein an integrate-and-reset pre-amplifier. This type ofpre-amplifier may be optimized to the fundamental limit for a targetsignal-to-noise ratio (SNR) for the specific image sensor output signalby signal processing techniques regardless of ADC type.

To achieve good noise performance within power budgets, one embodimentmay perform the quantization process using a weighted repeat withrespect to some pixel circuits. That is, for selected ones of the pixelcircuits, the quantization process may be repeated one or more times.The specific ones of the pixel circuits for which quantization may bedetermined through various mechanisms, such as trial and error.Performing the weighted repeat may allow for, e.g., reduced fixedpattern noise and reduced random noise for the fixed number ofquantization.

Various embodiments of an image sensing system may implement some or allof the various method and apparatus embodiments discussed above and infurther detail below.

Basic Image Sensor System:

Turning now to FIG. 1, a diagram illustrating one embodiment of aportion of an image sensor system is disclosed. In the embodiment shown,image sensor system 20 is implemented on an integrated circuit (IC)package having a stacked arrangement, including a top chip 12 and abottom chip 13. It is noted however that the physical arrangement of atop chip and bottom chip as shown here is not intended to be limiting,but rather is one possible physical implementation. However, the variousmethod and apparatus embodiments discussed herein may be implemented inany suitable manner. Furthermore, certain details of the image sensorsystem are not shown in FIG. 1, but will be illustrated in other figuresdiscussed below or will otherwise become apparent upon reading thisdisclosure.

Although not explicitly shown here (for the sake of simplicity) sensorsmay capture image data (e.g., video or still frame pictures). The imageinformation may be conveyed to pixel drivers 77 (which it is noted, areseparate from the pixel drivers in pixel circuits 103 discussed below).These pixel drivers may provide image information for each pixel topixel circuits 103 in top chip 12. Each of the pixel circuits 103 in theembodiment shown is in turn coupled to provide pixel data to an ADC 205.Current sources Ic may be provided in some embodiments to providecurrent on respective signal paths from which pixel data is conveyedform a pixel circuit 103 to an ADC 205. In various embodiments, the ADCs205 may be implemented as SAR ADCs.

Each of the ADCs may convert pixel data, received in analog form, into acorresponding digital value. The digital values generated by the variousADCs 205 may in turn be provided to ADC output buffers 121, whichprovide temporary storage. From there, the digital values correspondingto sampled pixel data are conveyed to sensor logic core/controlcircuitry 111. The sensor logic core of this functional circuit unit mayperform functions such as ordering of pixel data relative to otherpixels in the captured frame. The control circuitry portion of thisfunctional circuit block may generate and provide control signals forperforming a number of different control functions, many of which arediscussed below. These control functions include (but are not limitedto) pixel circuit selection, CDAC circuit element selection, ditheringsignal generation, controlling the sampling operation, controlling thepowering up and powering down of circuits and the manner in which itoccurs, and so on.

Digitized pixel data may be conveyed from sensor logic core/controlcircuitry 111 to output interface 171, and subsequently to otherprocessing circuitry which may utilize the image data in any suitablemanner.

FIG. 2 is a diagram illustrating one embodiment of a pixel unit 200.Although not explicitly shown in FIG. 1, each of the pixel circuits 103shown therein may be associated with particular one of the SAR ADCs 205.As shown here, each of these pixel circuits may be arranged in, e.g.,columns that are in turn coupled to a multiplexer 209. Each column mayinclude DC shift capacitors, which includes Csh1-Csh8 in this particularexample. These capacitors may block DC components of the pixel dataconveyed on the column line (which may be alternatively referred to as acolumn node) mitigating the pixel's DC offset impact. Accordingly, pixelcircuits 103 in this embodiment are AC coupled to SAR ADC 205, viamultiplexer 209.

The number of pixel circuits 103, and corresponding shift capacitors ina pixel unit 200 may vary from one embodiment to the next. Each columnis also coupled to a reset switch (SR1 through SR8 are shown in thisexample). These switches may be closed when it is desired to reset agiven column line, such as between quantization of the pixel circuits.

Multiplexer 209 in the embodiment shown is a one-hot multiplexerincluding a number of switches, SS1-SS8. Other types of multiplexers maybe implemented in lieu of this particular embodiment. When a given oneof the switches is closed, pixel data from the correspondingly coupledpixel circuit may be conveyed from the column line, through thecorresponding DC shift capacitor to SAR ADC 205. Control of the switchesSS1-SS8 may be performed based on control signals generated from controlcircuitry, such as that in sensor logic core/control circuitry 111.

SAR ADC in the embodiment shown includes a comparator 221, which isconfigured to compare the respective amplitudes of the signals receivedon its inputs. Each of the inputs is coupled to a corresponding resetswitch (SR9, SR10 as shown), which may be used to reset these circuitnodes similar to the resetting of the column nodes that may beperformed. These inputs may be reset between samples in order toeliminate any memory of previously processed pixel data.

A first one of the inputs to comparator 221 is coupled to receive thepixel data. As specified in the drawing, the connection between theoutput of the multiplexer and the corresponding input of the comparatorexcludes sample and hold circuitry. Since no sample and hold circuit isprovided here, the analog pixel data conveyed from the multiplexer onthe second input as a continuous but almost constant analog signal aftersufficient pixel settling. By not sampling the pixel data prior to itsinput into comparator 221, the impact of aliased thermal noise on theimage may be reduced.

The other input to comparator 221 in the embodiment shown is acorresponding analog signal provided from CDAC 231. This signalcorresponds to the digital value from SAR 233. As the contents of SARare updated for each comparison, the corresponding analog signal fromCDAC 231 is similarly updated for the next comparison/approximationperformed. When a conversion is complete, the contents of SAR 233 may beconveyed to, e.g., output buffers 121 as shown in FIG. 1.

Low Noise Image Sensing with Reduced Fixed Pattern Noise (FPN)

As previously noted, embodiments of an image sensing system in whichpixel data is provided to the input of comparators implemented incorresponding SAR ADCs as continuous but almost constant analog signals(and thus, without a sample and hold circuit performing a sample andhold operation) are possible and contemplated within the scope of thisdisclosure. As further noted, this may result in a reduction of aliasedthermal noise which can reduce image quality. The present disclosurecontemplates additional embodiments that may reduce noise that can havean adverse impact on a final image.

FIG. 3 illustrates one embodiment of a CDAC 231 and a correspondinglycoupled SAR 233. CDAC 231 as implemented here includes an array ofcircuit elements, each of which is referred to here as an instance ofcell 307. An example of cell 307 is shown in FIG. 3 includes amultiplexer 317 which may convey a value from either the R line or the Cline to inverter 327 (shown here in a transistor implementation).Depending on the input values and the selection, the terminal capacitorCc coupled to the output of multiplexer 317 is driven to the voltagerefp, or discharged to the voltage refn. Capacitor Cc may charge ordischarge accordingly, with the value Vx conveyed as part of the analogoutput signal from CDAC 231.

During a given conversion, not all cells are used. Instead, only certaincells are selected for use in converting the digital value stored in SAR233 into a corresponding analog signal. In the embodiment shown, theutilized cells may be randomly selected from one iteration (e.g., forone instance of pixel data) to the next. This type of random selectionmay result in the averaging out of linearity errors that might otherwisebe present due to mismatches of various circuit elements in CDAC 231.

The random selection may further be segmented into subsets, with therandomization within subsets being orthogonal with respect to therandomization within the other subset. In one embodiment, SAR 231 issubdivided into a first portion of storage locations coupled to providebits to portions of the array of circuit elements associated with mostsignificant bits (MSBs) of a digital value to be converted, and a secondportion of storage locations coupled to provide bits to a portion of thearray of circuit elements associated with a least significant bit (LSB)of the digital value to be converted. In this particular example, CDAC231 is a 10-bit CDAC In this example, 10-bit CDAC that is segmented into6-bit unary (bits B9-B4) and 4-bit binary (bits B3-B0), although thissegmentation may vary from one embodiment to the next dependent uponarea and target linearity budgets. For each input from pixel, cells 307corresponding to the unary portion are randomly selected by themultiplexers 313 and grouped to form most significant bits (MSBs) outputfrom CDAC 231. For the next input, the unary portion elements areshuffled and grouped again forming the same MSB nominal portions withdifferent cells 307 being selected, breaking fixed pattern nonlinearityerrors in the binary CDAC. In summary, cells 307 corresponding to theunary section are shuffled and the linearity errors are averaged overmultiple frames to spread the INL error peaks at specific codes intoother codes.

For the proposed scheme, extra randomization orthogonal to the MSBsections are introduced to the least significant bit (LSB) sections. Asshown in the FIG. 3, replicas of LSB sections are instantiated and oneof them is selectively chosen, with corresponding bits conveyed to theselected cells from SAR 233 through demultiplexer 303. This way extradynamic element shuffling further reduces fixed pattern errors in CDAC231 in the average sense over multiple frames. In this embodiment,wherein the random selection of cells is performed in subsets orthogonalto one another (for the purposes or randomization) is referred to istwo-dimensional orthogonal dynamic element matching, or 2DO-DEM. It isnoted however that this particular randomization scheme is but onepossible way. Generally speaking, any suitable randomization scheme forcell selection including data-directed methods may be performed withinthe scope of this disclosure.

Control of the randomization as discussed above may be controlled byrandom number generator (RNG)/logic 309. These functions include randomnumber generation which is provided to generate corresponding selectionsignals provided to the multiplexers 313 as well as to demultiplexer303. In one embodiment, RNG/logic 309 is a unit of the control circuitryimplemented in sensor logic/control circuitry 111 of FIG. 1. However,this circuitry may be implemented separately as well.

FIG. 4 illustrates one embodiment of an apparatus coupled to convey adithering signal to the input of an amplifier concurrent with anotherinput signal. It is noted that, for the sake of illustration, only aportion of the circuitry of comparator 221 is shown. These portionsinclude transistors M41-M43, capacitor Cin, and common mode resetswitches Scm1 and Scm2, which may reset the gate terminals of theirrespectively coupled devices to a common mode voltage, Vcm.

In the embodiment shown, comparator 221 is coupled to receive pixeldata, Vpix, via a multiplexer on a first input, via multiplexer 209. Onthe second input, the analog signal generated by CDAC 231 may bereceived. Additionally a dithering signal may also be applied to thisinput concurrent with application of the analog signal from CDAC 231.Generally speaking, any suitable signal generation circuitry arranged togenerate a dithering signal may be provided, with the correspondinginput of the comparator is being coupled to receive the ditheringsignal. In this particular embodiment, a second DAC 405 is provided, itsoutput coupled to the same input of comparator 221 as is the output ofCDAC 231. Control signals upon which the dithering signal is generatedare provided from the control circuitry in sensor logic core/controlcircuitry 111 of FIG. 1 for this particular embodiment. It is noted thatembodiments are possible and contemplated wherein the DAC circuitry usedto generate the dithering signal may be integrated into CDAC 231, ratherthan as a separate DAC as shown here. However, as noted above, anysuitable circuitry for generating a dithering signal may be provided inany embodiment falling within the scope of this disclosure.

The dithering signal applied to the input of comparator 221 as shown inFIG. 4 may be a random signal. Application of a random dithering signalimproves differential nonlinearity (DNL) performance of the SAR ADC,particularly at small input signal ranges associated with a cameraapplication. The dithering technique discussed herein may randomizesystematic linearity errors in CDAC 231 in addition to improving DNL.Furthermore, this particular embodiment applies the dithering signalbefore quantization on a per-frame basis. Accordingly the ditheringsignal, which is the same for a given frame, is removed after performingCDS without the introduction of extra noise in the output image, whilealso effectively minimizing small structured errors resulting from unitmismatch in CDAC 231.

FIG. 5 is a flow diagram illustrating one embodiment of a methodperforming an analog-to-digital conversion in a SAR ADC having a CDAC.Method 50 as disclosed herein may be provided by any of thecorresponding hardware embodiments of this disclosure. Additionalhardware embodiments not explicitly disclosed herein may also performmethod 50, and thus may also fall within the scope of this disclosure.

Method 50 is generally directed to converting the analog pixel data intodigital pixel data using a SAR ADC. The conversion of data includes theuse of a CDAC, and thus includes randomly selecting CDAC circuitelements from a first subset (block 502). As shown above, the CDACincludes a two-dimensional array of circuit elements, while theconverting includes the CDAC converting a digital value stored in a SARof the SAR ADC into a corresponding analog signal. Thus, in thisembodiment, converting the digital value into the corresponding analogsignal comprises the control circuit causing random ones of the circuitelements being selected for generation of the corresponding analogsignal, including those circuit elements of the first subset. Randomlyselecting circuit elements of the first subset includes randomlyselecting circuit elements associated with MSBs of the digital valuestored in the SAR. Method 50 further comprises randomly selecting CDACcircuit elements from a second subset, wherein the selection of elementsof the second subset is orthogonal with respect to selection of elementsof the first subset (block 504). This in turn includes randomlyselecting circuit elements associated with an LSB of the digital valuestored in the SAR for performing the conversion to analog, and thusrandomly selecting circuit elements associated with the LSB is performedorthogonally with respect to randomly selecting circuit elementsassociated the MSBs.

Upon selection of circuit elements of the first and second subset,method 50 further includes converting contents of the SAR to an analogsignal, using the selected elements of the first and second subsets(block 506). Converting the data includes providing the correspondinganalog signal (from the CDAC) to a first input of a comparator,providing the analog pixel data from the one of the plurality of pixelcircuits to a second input of the comparator. This includes receivingthe analog pixel data from the selected pixel circuit as a continuoussignal, with no sample and hold performed (per block 508, with no sampleand hold circuitry coupled to the corresponding comparator input). Theconversion also includes writing a result of comparing the correspondinganalog signal and the analog pixel data from an output of the comparatorto the SAR (block 510). This may be done in a manner of successiveapproximations, in accordance with the operation of a SAR ADC.

In addition to the random selection of circuit elements within the CDACwhen performing a conversion of pixel data into the digital domain,further randomization may be achieved by randomly selecting pixelcircuits for which pixel data is to be converted. Returning briefly toFIG. 2, the selection of pixel circuits 103 within a pixel unit may berandomized. For the embodiment illustrated in FIG. 2, this may bereferred to as column shuffling, although the disclosure herein is notlimited to this type of randomization in the selection of pixelcircuits.

FIG. 6 is a flow diagram illustrating one embodiment of a method forselecting pixel circuits in the processing of pixel data. Method 60 asshown in FIG. 6 is generally directed to the random selection of pixelcircuits for the quantization of corresponding pixel data, and may applyto the embodiment of FIG. 2, as well as to other embodiments notexplicitly discussed herein (but may nevertheless fall within the scopeof this disclosure).

Method 60 includes randomly selecting a first pixel circuits forconversion of pixel data from analog to digital (block 602). In variousembodiments, this includes randomly selecting the one of the pluralityof pixel circuits to provide corresponding analog pixel data for digitalconversion using a SAR ADC. Furthermore, randomly selecting may comprisea control circuit (such as that shown in FIG. 1) causing a multiplexerto select the one of the plurality of pixel circuits. After data hasbeen quantized (e.g., converted from analog to digital) for the firstselected pixel circuit, the method may randomly select the next pixelcircuit for conversion of pixel data from analog to digital (block 604).After this conversion is complete, if the number of unselected pixelcircuits is greater than 1 (block 606, yes), the next pixel circuit maybe selected per block 604. This loop may continue until the number ofunselected pixel circuits is one (block 606, no). Thereafter, pixel datafrom the last unselected pixel circuit is converted from analog todigital (block 608), and the method thereafter proceeds to the nextframe (block 610) and repeats.

The randomization described above may reduce the effects of fixedpattern noise (FPN) which may otherwise result if the pixel circuits areselected in repetitive sequence. Randomly shuffling the sequence mayreduce the FPN error to random noise.

FIG. 7 is a flow diagram illustrating one embodiment of a method forperforming a comparison in which a dithering signal is applied alongwith an input signal to one input of the comparator. Method 70 may beperformed using any of the various hardware embodiments discussedherein, as well as others that, by virtue of ability to perform themethod, fall within the scope of this disclosure.

Method 70 includes applying an analog signal corresponding to SARcontents from a CDAC to a first comparator input (block 702). The methodfurther includes generating a dithering signal and applying thedithering signal to the first input of the comparator concurrent withproviding the corresponding analog signal (block 704). The pixel data isapplied to a second comparator input as a continuous analog signal(block 706). Based on the signals provided to the first and secondinputs, a comparison of their respective amplitudes is performed (block708), with the results of the comparison provided to the SAR as part ofthe successive approximation performed in converting pixel data fromanalog to digital. Thereafter, method 70 proceeds to the next comparison(block 710) and repeats beginning with block 702.

As previously discussed, the dithering signal may, in one embodiment, begenerated by a DAC that is separate from the CDAC, or provided via extracircuitry integrated into the existing CDAC. Any other suitable signalgeneration circuitry may be used as well. The use of the ditheringsignal may improve DNL performance and thus reduce degradation to imagesproduced by the image sensing system.

Circuit for Clock Feedthrough Compensation in Image Sensing Systems:

FIG. 8 is an illustration of one embodiment of a pixel circuit.Generally speaking, various embodiments of a pixel circuit as disclosedherein include a first driver circuit coupled to receive an analog pixeldata, a transfer signal and a reset signal, a source follower transistorhaving a source terminal coupled to a column node and a gate terminal,wherein the gate terminal of the source follower is coupled to the firstdriver circuit and a second driver circuit coupled to receive thetransfer signal and the reset signal, wherein the second driver circuitwhich may be shared by each column is capacitively coupled to the columnnode through a first capacitor.

The schematic shown in the left hand portion of FIG. 8 generallyillustrates an embodiment of a pixel circuit without compensation. Inthe embodiment shown, driver circuit includes a reset transistor, M1,and a transfer gate, M2. The reset transistor M1 is coupled to receive areset signal (RST), and when active, pulls the node Vfd up toward Vdd.This reset may be performed between the iterations of quantizing pixeldata received and conveyed by driver 105 (shown in the box delineated bydashed lines). Assertion of the transfer gate (TG) signal activatestransistor M2, thereby allowing pixel data (Vppd) to pass through thegate to node Vfd. This node is coupled to a gate terminal of transistorM3, which is coupled as a source follower to the column line (which mayalternatively be referred to as the column node). Source follower M3 mayamplify the pixel data that is conveyed onto the column line, where itis subsequently passed through a multiplexer to a comparator input whenthe pixel data from this circuit is to be quantized. Capacitors Cppd andCfd represent capacitances existing between their respective nodes and areturn path.

The right hand portion of FIG. 8 illustrates an embodiment of a pixelcircuit 103 as implemented in, e.g., the pixel unit shown in FIG. 2 anda compensation circuit 106. Compensation driver 106 in this embodimentis coupled to the column lines by capacitors Ccal1 and Ccal2, although asingle capacitor may be used instead. These capacitors may be adjustableor trimmable depending on the pole from the pixel driver path and zerofrom the compensation driver path. The capacitors block any DC voltagefrom compensation circuit 106, and thus the circuit is AC coupled to thecolumn line.

As with the column lines shown in FIG. 1, that shown in FIG. 8 include acurrent source, Ic, to provide current on the respective signal path.For simplicity, typical pixel row selection switch between source follow(M3) and column line is not shown.

The effect of the operation of compensation driver is to provide acorrelated disturbance voltage to the column line, which in turn resultsin faster settling time. In particular, the disturbance voltage maydrive the column line (or column node) to its steady state value fasterowing to the introduced zero in the feedforward path, as a result of thedisturbance voltage, than would otherwise occur in the absence of thecompensation driver. For a pixel driver such as that shown in theleft-hand side of FIG. 8, the transitions resulting from assertion ofthe RST and TG signal may result in the column signal, Vcol, becomedisturbed from an effect known as clock feedthrough. This can introducea non-uniform CDS residue pattern for that occurs for a certain numberof pixels and corresponding column lines due to incomplete settling. Theaccumulated result of this may be increased FPN. By reducing therequired settling time, as a result of the compensation driver, lowerpower may be consumed for a given noise budget, and/or noise may bereduced for a given timing budget. Further accuracy of the disturbancevoltage can be attained through tuning the adjustable capacitors shownhere (or single adjustable capacitor if only one is present).

FIG. 9 is a flow diagram illustrating one embodiment of a method foroperating a pixel circuit. Method 90 may be performed by variousembodiments of the pixel circuit disclosed herein, as well as otherembodiment not explicitly disclosed.

Method 90 begins with the assertion of a reset signal and performing areset of a main pixel driver and a compensation pixel driver (block 92).In one embodiment, the main and compensation pixel drivers may have asimilar or identical circuit topology, although their coupling to acolumn node may be different. Performing the reset includes conveying afirst voltage to a gate terminal of a source follower transistor,wherein a source terminal of the source follower transistor is coupledto a column node (or column line), and conveying a second voltage to thecolumn node, the second driver circuit being capacitively coupled to thecolumn node. Referring back to FIG. 8, conveying the first voltage maycomprise pulling the Vfd node of the main pixel driver toward Vdd. Whilethe compensation circuit provides controlled disturbance that is pulledtoward Vdd with a potential DC offset, the capacitance coupled betweenit and the column line blocks the transfer of DC components, and thusthe second voltage is primarily an AC component related to the switchingof the corresponding reset transistor.

Method 90 further includes asserting a transfer gate signal into boththe main and compensation driver circuits (block 94). As a result of theassertion of the transfer gate signal, a voltage corresponding to thepixel data is conveyed to the gate terminal of a source follower coupledbetween the main driver and the column node (block 96). This results inanother voltage being conveyed to the column node, the voltagecorresponding to clock feedthrough amplified by the source follower. Themethod further includes conveying, responsive to assertion of thetransfer gate signal, a disturbance voltage, via the capacitor(s), fromthe compensation driver to the column node (block 98). The disturbancevoltage may include a version of the clock feedthrough voltage andcontrolled AC components of the transfer gate signal, and may causesettling to a steady state value to occur faster on the column node.

Note that the proposed clock feedthrough scheme can be applied tosimilar pixel topologies of which performance is impacted by the clockfeedthrough regardless of the ADC architecture.

High Speed, Low Power Image Sensing:

FIG. 10 is a diagram illustrating one embodiment of an apparatus forcontrolling the slope of a power enable signal and a diagramillustrating operation of the same. In the embodiment shown, comparator221 is shown as being coupled to an RLC circuit (including a powersupply, resistor R, inductor L, and a capacitor C), for the sake ofillustration. The comparator 221 is part of an ADC, such as those shownin FIG. 1.

Comparator 221 in the embodiment shown includes a current source, I1,which may be implemented as a transistor or other suitable circuitry.This current source is coupled to receive a power enable signal from DAC241. In turn, DAC 241 may receive control signal from control circuitryin, e.g., sensor logic core/control circuitry 111. These control signalsmay be used to control the slope of the power enable signal to provide apower up and power down sequence with minimum disturbance to the supply.DAC 241 may generate the power enable signal by converting the controlsignals from their received digital values into an analog signal.Comparator 221 may thus power up and power down in a manner that reducespower supply noise, as the current demand does not change as fast. Thiscan reduce voltage droops and power supply noise that can affect imagequality.

As shown in the timing diagram, the power enable signal may be used tocycle the power of the comparator during a quantization cycle. Aspreviously noted, one embodiment of the image sensing system in whichcomparator 221 is implemented performs correlated double sampling, orCDS, in which data from pixel circuits is quantized twice. This may beperformed under the control of the control circuitry discussed above.Within the first quantization cycle, comparator 221 may be powered on toprocess the reset input signal, powered down after the firstquantization, powered up again for the pixel image signal, and thenpowered down. Accordingly, comparator 221 may be powered down during asettling time of a column line, and powered up to process the pixeloutput, powered down for the next settling time, and powered up for thenext pixel output. Thereafter, the comparator 221 may be powered downagain and remain so until the next CDS cycle. As can be seen in thediagram, the slope of the power enable signal is shaped such that theincrease in current draw is smooth during the power up portion, whilethe decrease in current draw is smooth during the power down portion.Accordingly, power supply transients resulting from the powering on andoff of comparator 221 are minimized if not eliminated. As a result,power supply noise from this power cycling is correspondingly minimizedor eliminated.

In addition to controlling the shape of the power enable signal, thecontrol circuitry in the system may also monitor for ringing that mayresult from powering up and powering down comparator 221. Responsive tothis monitoring, the control circuitry may adjust the control signalsand thus, adjust the slope of the power enable signal provided to thevarious instances of comparator 221 to reduce or eliminate the ringingin real time. Other factors may be monitored for as well, with thecontrol circuitry making adjustments to the control signals, and thusthe slope of the power enable signal, as needed.

Conventional power cycling, in which the slope of the power signal isnot shaped based on the response or characteristic of the distributedsupply and package, may result in increased power supply disturbance dueto surge currents. The power cycling shown in the timing diagram asshown here may result in a reduction of both fixed pattern and randomnoise in the image.

In addition to the noise benefits described above, cycling the power tocomparator 221 may result in reduced power consumption. In image sensingsystems having a significant number of ADCs, this reduction can besignificant, as the comparators may actually spend more time powereddown than powered up, given that they are powered up only duringprocessing pixel data.

Another power cycling feature that may be performed is to stagger thepower enable signals to different comparators to prevent multiplecomparators (or too many) from powering up at substantially the sametime.

Note that the proposed system response based power enable signal slopeshaping can be applied to any low power ADC architectures.

FIG. 11 is a diagram illustrating one embodiment of anintegrate-and-reset pre-amplifier used in an embodiment of a low powercomparator optimized for the image sensor outputs. In the embodimentshown, pre-amplifier 227 includes an amplifier having transistors M5 andM6 having respective gate terminals for receiving input signals In1 andIn2. These signals may be the pixel data and analog value output fromthe CDAC as discussed above. A current source Io is coupled to drawcurrent through M5 and M6. The output nodes of pre-amplifier 227 areOut+ and Out−, on the drain terminals of M5 and M6, respectively.Capacitors CL are coupled between each of the drain terminals and powersupply node Vdd. A pair of reset switches (‘Reset’) are provided acrossthe capacitors. These switches, when closed, may perform a reset bydischarging any potential different across their respective capacitorCL. This reset may be performed periodically or as needed.

In image sensing systems, the overall readout power consumption may bedominated by a comparator pre-amplifier implemented in the ADC. In theembodiment shown in FIG. 11, the comparator pre-amplifier power may beoptimized to the fundamental limit for the target signal-to-noise ratio(SNR) based on the signal processing technique. More specifically, thematched filter theory predicts that the SNR of the amplifier with inputsignal characteristic specific to the image sensor system (e.g.approximately DC signal) depends only on the average current applied(e.g. available energy). Therefore, the optimal comparator pre-amplifierin the image sensor ADC in terms of SNR for the given power may be theintegrator and reset type structure as shown in FIG. 11. With thiscomparator pre-amplifier structure, the overall ADC power in the imagesensor system may achieve minimum power for the given SNR specification.

Note that the pre-amplifier based on integrate-and-reset can be employedfor any ADCs for low power image sensor applications.

FIG. 12 is a table illustrating repeat quantization patterns usable inone embodiment of a low power image sensing system for target RN and FPNunder the constraint of fixed total quantization number. Thequantization patterns shown here may be performed under the control ofthe control circuitry discussed above. The bit positions correspond topixel circuits and therefore, to pixel data from these pixel circuits.In the embodiment shown, two different possible repeat patterns areshown. In the first pattern, labeled here as Rpt4, a quantization cycle(which may include performing CDS) is performed only once for bits B9,B8, B7, B5, and B4. Meanwhile, for B6 and B3-B0, quantization isrepeated once for each, and thus performed twice overall in each ofthese positions. This pattern is referred to herein as a weighted repeatpattern, where some bits are weighted and thus their sampling process isrepeated at least once.

In the second pattern, Rpt8, repeat quantization is performed for thesame bits, although bits B3 and B2 are weighted more than the others. Inthis example, quantization for B3 and B2 are repeated three times, for atotal of four quantizations each for these bits. Generally speaking, thenumber of repeats for a given position may be repeated any suitablenumber of times while reducing repeats in other bits to maintain totalnumber of quantization.

Generally speaking, the weighted repeat methodology discussed herein maybe performed in a wide variety of patterns without changing total numberof quantization (hence, total energy). The weighted repeat may be usedduring the SAR ADC process to improve not only random noise but alsobias (hence, FPN) with a small incremental hardware for the given powerbudget. One simple example to introduce redundancy is repeating the SARprocessing multiple times for the least significant bit (LSB) to improverandom noise performance. However, the blind repeat of LSB for SAR ADCin the image sensor system can cause larger fixed pattern noise.Accordingly, additional and/or different bits may be selected for repeatquantization in accordance with the various embodiments disclosed here.It is further noted that the control circuitry discussed above canchange the repeat patterns if conditions warrant. Furthermore, patternsmay be implemented wherein quantization of some bits are repeated once,while other bits undergo repeat quantization more than once.

FIG. 13 is a flow diagram of one embodiment of a method for powering upand powering down a comparator using a slope-controlled power enablesignal. Method 130 may be performed with any of the various hardwareembodiments discussed herein. Image sensing system capable of performingmethod 130 not explicitly discussed herein may nevertheless fall withinthe scope of this disclosure.

Method 130 begins with the conveying of pixel data as an analog signalto a comparator (block 131). The pixel data may be conveyed from a pixelcircuit that is selected according to control signals (e.g., selectionsignals) provided by control circuitry. The pixel data may be conveyedthrough a multiplexer to the comparator of a SAR ADC. The controlcircuitry may also power up the comparator to which the pixel data isconveyed, using a slope controlled power enable signal (block 132). Theshape of the power enable signal may, in one embodiment, be controlledbased on control signals conveyed from the control circuitry to a DAC.

With the DAC powered on, the comparison may be performed (block 133),the result thereof being stored in a SAR of a SAR DAC. Upon completingthe quantization, the control circuit may cause the comparator to bepowered down again under the control of the slope controlled powerenable signal (block 134). Thereafter, the method proceeds to the nextquantization (block 135) and repeats.

FIG. 14 is a flow diagram illustrating one embodiment of a method forselectively repeating a quantization process for particular ones of anumber of pixel circuits. Method 140 may be performed by any of theembodiments of an image sensing system disclosure herein, as well asothers not explicitly disclosed herein but nevertheless falling withinthis disclosure's scope.

Method 140 may be performed using either of the repeat patterns shown inFIG. 12, or other patterns not explicitly discussed herein. The methodbegins with the selection of a pixel circuit for performing aquantization process of pixel data (block 141). If the pixel circuit isone that is designated for a repeat (block 142, yes), the quantizationprocess (which may include CDS) maybe repeated the designated number oftimes (block 144). If the pixel is not one designated for repeatquantization (block 142, no), one quantization process of the pixel datais performed (block 143). After quantization of the designated pixeldata is complete, the next pixel circuit is selected, and the methodrepeats from block 142.

Turning next to FIG. 15, a block diagram of one embodiment of a system150 is shown. In the illustrated embodiment, the system 150 includes atleast one instance of an integrated circuit 10 coupled to externalmemory 158. The integrated circuit 10 may include a memory controllerthat is coupled to the external memory 158. The integrated circuit 10 iscoupled to one or more peripherals 154 and the external memory 158. Apower supply 156 is also provided which supplies the supply voltages tothe integrated circuit 10 as well as one or more supply voltages to thememory 158 and/or the peripherals 154. In some embodiments, more thanone instance of the integrated circuit 10 may be included (and more thanone external memory 158 may be included as well).

The peripherals 154 may include any desired circuitry, depending on thetype of system 150. For example, in one embodiment, the system 150 maybe a mobile device (e.g. personal digital assistant (PDA), smart phone,etc.) and the peripherals 154 may include devices for various types ofwireless communication, such as WiFi, Bluetooth, cellular, globalpositioning system, etc. The peripherals 154 may also include additionalstorage, including RAM storage, solid-state storage, or disk storage.The peripherals 154 may include user interface devices such as a displayscreen, including touch display screens or multitouch display screens,keyboard or other input devices, microphones, speakers, etc. In otherembodiments, the system 150 may be any type of computing system (e.g.desktop personal computer, laptop, workstation, tablet, etc.).

Various embodiments of the IC 10 and/or peripherals 154 may includecircuitry for implementing one of the various image sensing systemsdiscussed above. As shown in FIG. 1, portions of the system may be ondifferent chips, although implementations wherein the entirety of theimage sensing system is implemented on a single chip are possible andcontemplated.

The external memory 158 may include any type of memory. For example, theexternal memory 158 may be SRAM, dynamic RAM (DRAM) such as synchronousDRAM (SDRAM), double data rate (DDR, DDR2, DDR3, LPDDR1, LPDDR2, etc.)SDRAM, RAMBUS DRAM, etc. The external memory 158 may include one or morememory modules to which the memory devices are mounted, such as singleinline memory modules (SIMMs), dual inline memory modules (DIMMs), etc.

Numerous variations and modifications will become apparent to thoseskilled in the art once the above disclosure is fully appreciated. It isintended that the following claims be interpreted to embrace all suchvariations and modifications.

What is claimed is:
 1. A circuit comprising: a first driver circuitcoupled to receive a transfer signal and a reset signal; a sourcefollower transistor having a source terminal coupled to a column nodeand a gate terminal, wherein the gate terminal of the source follower iscoupled to the first driver circuit; and a second driver circuit coupledto receive the transfer signal and the reset signal, wherein the seconddriver circuit is capacitively coupled to the column node through afirst capacitor.
 2. The circuit as recited in claim 1, wherein the firstdriver circuit includes a first reset transistor and a first transfergate, and wherein the second driver circuit includes buffer stages orduplicated first driver circuit implemented with a second resettransistor and a second reset gate.
 3. The circuit as recited in claim2, wherein the first reset transistor is configured to be activatedresponsive to assertion of the reset signal, and wherein responsive tothe assertion of the reset signal, the first reset transistor isconfigured to pull a voltage on the gate terminal of the source followertoward a supply voltage on a supply voltage node.
 4. The circuit asrecited in claim 2, wherein the second reset transistor is configured tobe activated responsive to assertion of the reset signal, whereinresponsive to assertion of the reset signal, the second reset transistoris configured to pull an internal node of the second driver circuittoward a supply voltage on a supply voltage node.
 5. The circuit asrecited in claim 2, wherein the first transfer gate is configured totransfer analog pixel data to the gate terminal of the source followerresponsive to assertion of the transfer signal, wherein the sourcefollower is configured to amplify a magnitude of the analog pixel dataon the column node.
 6. The circuit as recited in claim 2, wherein thesecond transfer gate is configured to transfer, via capacitive coupling,a disturbance voltage to the column node responsive to activation of thetransfer signal.
 7. The circuit as recited in claim 1, wherein thesecond driver is capacitively coupled to the column node by one or moreadjustable capacitors.
 8. The circuit as recited in claim 1, wherein thecolumn node is coupled to an input of a multiplexer, and wherein anoutput of the multiplexer is coupled to an analog-to-digital converter(ADC).
 9. A method comprising: asserting a reset signal; conveying, froma first driver circuit and in response to assertion of a reset signal, afirst voltage to a gate terminal of a source follower transistor,wherein a source terminal of the source follower transistor is coupledto a column node; conveying, from a second driver circuit and inresponse to assertion of the reset signal, a second voltage to thecolumn node, the second driver circuit being capacitively coupled to thecolumn node; asserting a transfer signal; conveying, from the firstdriver circuit and in response to assertion of a transfer signal, athird voltage to the gate terminal of the source follower transistor;and conveying, from the second driver circuit and in response toassertion of the transfer signal, a fourth voltage to the column node.10. The method as recited in claim 9, wherein conveying the firstvoltage to the gate terminal of the source follower transistor comprisespulling the voltage on the source follower toward a supply voltagepresent on a supply node.
 11. The method as recited in claim 9, whereinconveying the second voltage to the column node comprises conveying asupply voltage to a capacitance coupled between the second drivercircuit and the column node.
 12. The method as recited in claim 9,wherein conveying a third voltage comprises the driver circuit conveyingpixel data to the gate terminal of the source follower.
 13. The methodas recited in claim 9, wherein conveying the fourth voltage comprisesthe driver circuit conveying a controlled to a capacitance coupledbetween the second driver circuit and the column node.
 14. The method asrecited in claim 9, further comprising conveying an analog signal on thecolumn node to an analog-to-digital converter, and converting the analogsignal into a digital value.
 15. A system comprising: a plurality ofpixel units configured to receive pixel data and convert the pixel datainto a digital format, wherein each pixel unit includes a plurality ofpixel circuits and an analog-to-digital converter (ADC), wherein each ofthe pixel circuits includes: a pixel driver circuit coupled to receive atransfer signal and a reset signal; a source follower transistor havinga source terminal coupled to a column node and a gate terminal, whereinthe gate terminal of the source follower is coupled to the pixel drivercircuit; and a compensation circuit coupled to receive the transfersignal and the reset signal, wherein the compensation circuit iscapacitively coupled to the column node through a capacitor.
 16. Thesystem as recited in claim 15, wherein the pixel driver circuit of eachof the plurality of pixel circuits includes a first reset transistor anda first transfer gate, and wherein the compensation circuit includes asecond reset transistor and a second transfer gate, wherein the firstand second reset transistors are configured to be activated responsiveto assertion of a reset signal, and wherein the first and secondtransfer gates are configured to be activated responsive to assertion ofa transfer signal.
 17. The system as recited in claim 16, wherein thefirst reset transistor is configured to, when active, pull a voltage onthe gate terminal of the source follower transistor toward a supplyvoltage on a supply voltage node, and wherein the second resettransistor is configured to, when active, pull a first terminal of thecapacitor toward the supply voltage.
 18. The system as recited in claim16, wherein the first transfer gate is configured to, when active,transfer pixel data to the gate terminal of the source followertransistor.
 19. The system as recited in claim 18, wherein the capacitoris an adjustable capacitor configured to convey a controlled disturbancevoltage onto the column node via a second terminal of the capacitorresponsive to receiving the transfer signal on a first terminal.
 20. Thesystem as recited in claim 18, further comprising the source followertransistor amplifying a voltage of the pixel data on the column node.